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Method for utilizing stubby pins to provide flexural compliance for BGA interconnects with low-CTE packages

IP.com Disclosure Number: IPCOM000010187D
Publication Date: 2002-Oct-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for utilizing stubby pins to provide flexural compliance for ball-grid array (BGA) interconnects with low-coefficient for thermal expansion (CTE) packages. Benefits include improved reliability.