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Cost Reduction Using Vertical Tie-Bar Clips

IP.com Disclosure Number: IPCOM000010211D
Publication Date: 2002-Nov-06
Document File: 6 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database


Improvement in the electrical resistance of semiconductor packages can be improved by using a clip in place of wire bonds (see Figure 1) Key Words: Tie-bar, clips, lead-frame Reducing the cost of processing clips may be achieved through two methods. One method is by increasing the number of clips per unit length of frame. And a second method is reducing the clearance between the tie-bar edge and the side of the package, thereby providing more clearance and permitting a smaller package size. The cost of the clip fabrication can be broken into material cost and stamping cost. The material itself contributes the majority of the clip cost. This means a denser clip distribution within a fixed length will provide a less expensive clip unit cost. By increasing the number of clips per frame length, the design of a vertical tie bar clip frame will reduce the cost substantially.