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Method for a socket-T LGA contact cover

IP.com Disclosure Number: IPCOM000010215D
Publication Date: 2002-Nov-06
Document File: 3 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database


Disclosed is a method for a socket-T land-grid array (LGA) contact cover. Benefits include improved reliability.

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Method for a socket-T LGA contact cover

Disclosed is a method for a socket-T land-grid array (LGA) contact cover. Benefits include improved reliability.


        � � � � � LGA contact causes damage during the handling and shipping of a motherboard-mounted socket. Historical shipping data common to fragile CPU-related components indicates a fallout rate of ~12,000 defects per million (DPM).

        � � � � � Currently, mPGA sockets, by having an interfacing surface (top cover) allow for the use of polyimide tape to cover the subsurface contacts (see Figure 1). Pick-and-place covers are also viable as long term protection of the socket contacts as the contacts are contained within the socket body. Furthermore, micro pin-grid array (mPGA) sockets have no structural components in close contact with the sides of the socket.

� � � � � The LGA socket design uses spring contacts that are contoured 3-dimensional surfaces to ensure electrical connection with the CPU package pads. The contacts cannot be protected in the conventional sense with the use of polyimide tape. Pick-and-place covers interfere with both the motherboard functional test process and the DSL components.

General description

        � � � � � The disclosed method is an injection-molded component (part) used to protect LGA socket contacts from handling and shipping damage.

        � � � � � The key elements of the method include:

•        � � � � Slight interference fit common to direct socket loading (DSL) load plate integrated heat spreader (IHS) opening for retention

•        � � � � Finger tab for aid in removal from DSL load plate

•        � � � � Perimeter lip to prevent over-insertion


        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved reliability due to defect reduction