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Method for attachment/loading to optimize thermal interface thickness between a heatsink and a bare die

IP.com Disclosure Number: IPCOM000010219D
Publication Date: 2002-Nov-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attachment/loading to optimize thermal interface thickness between a heatsink and a bare die. Benefits include improved thermal performance, improved reliability, and improved ease of manufacturing.