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Direct Contact Thermal Interface Materials with Single Layer Solder Coated Metal Spheres

IP.com Disclosure Number: IPCOM000010220D
Publication Date: 2002-Nov-06
Document File: 3 page(s) / 36K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a single layer of a thermal interface material (TIM), composed of copper or silver spheres with a solder coating. Benefits include better bonding, lower thermal resistance, and a polymer matrix that provides mechanical flexibility.