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Applying Calibrated Models For Wafer Print Simulation Using Mask Optical Images

IP.com Disclosure Number: IPCOM000010245D
Publication Date: 2002-Nov-12
Document File: 6 page(s) / 115K

Publishing Venue

The IP.com Prior Art Database

Abstract

The application of calibrated models to mask inspection images for wafer print simulation is described. In particular, two approaches for determining the appropriate thresholds are described. Also, the handling of isolated defects is considered. Use of these approaches can facilitate more automated and accurate mask inspection processes. In particular, it is possible to automatically compute defect severity scores using this approach without the need for human intervention to calibrate the model. Also, the same model can be used from the design stage (e.g. OPC) through to manufacturing.