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Method for uniformed cooling of substrates after a molding process for warpage elimination

IP.com Disclosure Number: IPCOM000010250D
Publication Date: 2002-Nov-13
Document File: 2 page(s) / 28K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for uniformed cooling of substrates after a molding process for warpage elimination. Benefits include improved reliability.