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The disclosed method is a bath regen process used to accomplish electroless cobalt plating. Benefits include reduced defects, wafer to wafer non-uniformity, chemical and waste disposal costs.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
64% of the total text.
Electroless Cobalt Plating Bath Regen
Process and Integrated System
The disclosed method is a bath regen process used to
accomplish electroless cobalt plating. Benefits include reduced defects, wafer
to wafer non-uniformity, chemical and waste disposal costs.
Currently, no bath regen exists, and
electroless cobalt particles are generated in the plating bath due to a short
bath life. Electroless cobalt particles are deposited on the wafer surface,
causing significant leakage between copper lines. No closed loop integrated thin film metrology exists to measure film
thickness, which results in a large wafer to wafer non-uniformity.
Presently the bath life is limited to resolve electroless cobalt
particles generation. However, frequent bath change increases chemical
costs, decreases tool availability, and increases hazardous waste generation
and waste disposal costs.
The disclosed method contains the following elements:
An electroless plater including: deposition cells, pre-treat and
post-treat cells, SRD/EBR, anneal, wafer handling parts,
automation/electrical units, and a bath module with two or more tanks
A regen unit with electroless bath storage tanks for cooling,
filtering, and recirculation/treatment capabilities (such as acidification
An electroless plating bath dosing/metro unit
The following steps describe the electroless cobalt plating
bath regen process (see Figure 1):
Collect the electroless plating bath in off-line sto...