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Electroless Cobalt Plating Bath Regen Process and Integrated System

IP.com Disclosure Number: IPCOM000010328D
Publication Date: 2002-Nov-20
Document File: 2 page(s) / 29K

Publishing Venue

The IP.com Prior Art Database

Abstract

The disclosed method is a bath regen process used to accomplish electroless cobalt plating. Benefits include reduced defects, wafer to wafer non-uniformity, chemical and waste disposal costs.