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Method for high-temperature reflow carrier studs used to create a fixed minimum BGA solder-joint stand-off height between the substrate and the interposer

IP.com Disclosure Number: IPCOM000010330D
Publication Date: 2002-Nov-20

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for high-temperature reflow carrier studs used to create a fixed minimum ball-grid array (BGA) solder-joint stand-off height between the substrate and the interposer. Benefits include improved reliability and improved design flexibility.