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Method for a polishing head and a lapping technique for precision cross-sectioning and recovery of nonplanar ultra-thin die in SCSP and other BGA packages

IP.com Disclosure Number: IPCOM000010331D
Publication Date: 2002-Nov-20

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a polishing head and a lapping technique for the precision cross-sectioning and recovery of nonplanar ultra-thin die in stack chip scale packages (SCSPs) and other ball-grid array (BGA) packages. Benefits include improved functionality and improved ease of manufacturing.