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Depopulated Ball/Land Grid Array Patterns on Components with Integrated Heat Spreaders

IP.com Disclosure Number: IPCOM000010332D
Publication Date: 2002-Nov-20

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses “columns or rows” of solder spheres on area arrays to connect a component’s substrate to the distributing board. Benefits include eliminating solder joint cracks from high-risk locations.