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Disclosed is a method for trace/glass orientation and trace pitch design rules to normalize dielectric constant (Dk) variations of reinforced material. Benefits include improved performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
50% of the total text.
trace/glass orientation and trace pitch design rules to normalize Dk variations
of reinforced material
Disclosed is a method
for trace/glass orientation and trace pitch design rules to normalize
dielectric constant (Dk) variations of reinforced material. Benefits include
� � � � � Local Dk variations and impedance (Zo)
variations are caused by local glass/resin variations when woven glass fabric
is used as material reinforcement. Minimizing Dk solves the issue of Zo variations
and reduces timing jitter issues that result from Dk variations.
� � � � � A conventional method of reducing Dk
variation in glass woven-reinforced PCB laminate materials is to use multiple
layers of woven glass fabric in the dielectric and wider traces for the bus
� � � � � The conventional
solution is to place board design/traces at or near parallel or perpendicular
angles to the glass fabric weave of the material (see Figures 1 and 2). The
traces are not intentionally spaced at the same increments as the glass weave
of the dielectric.
� � � � � The disclosed method uses input/output
(I/O) routing to average/normalize the dielectric constant variation caused by
glass weave topography across lines of bus on reinforced material (see Figure
� � � � � The key elements of the method include:
• � � � � I/O routing
• � � � � Dk distortion from
line to line removed by I/O trace routing methodology