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A Solder Resist Trench that Increases Underfill Underneath the Die While Restricting the Flow of Underfill to the Corners of the Die

IP.com Disclosure Number: IPCOM000010419D
Publication Date: 2002-Nov-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that controls the flow of underfill by directing it underneath the die, and also by inhibiting it on the solder resist surface. Benefits include an increased amount of underfill flowing underneath the die, and reduced mechanical stresses between the cured underfill and the die corners.