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Passive Thermal FH Adjust to Compensate Temperature Driven Head Disk Spacing Changes

IP.com Disclosure Number: IPCOM000010443D
Original Publication Date: 2002-Dec-03
Included in the Prior Art Database: 2002-Dec-03

Publishing Venue

IBM

Abstract

There is a potential problem with todays read/write heads that thermally induced protrusion can be 0.07nm/degC. This means that (keeping other parameters constant) the magnetic and mechanical spacing would change by more than 3.5nm in normal operating ranges (5-55deg C for mobile drives). Below the current 15 nm magnetic spacing, this becomes an increasingly important contribution to the overall design budget. If not addressed, this problem will eliminate further areal density increases.