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Quality AlignmentTargets for Thick Sputtered Film Deposition

IP.com Disclosure Number: IPCOM000010454D
Original Publication Date: 2002-Dec-03
Included in the Prior Art Database: 2002-Dec-03

Publishing Venue

IBM

Abstract

Quality alignment marks and overlay test sites are crucial for pattern recognition in photolithographic steppers and overlay metrology systems. Producing quality targets in thick sputtered materials is challenging due to the type of edges that can occur over the underlying layer. This disclosure describes a method to tackle these challenges.