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Solder Mask Design for Improving BGA Performance

IP.com Disclosure Number: IPCOM000010570D
Publication Date: 2002-Dec-18

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a solder mask design to bridge the balls in the BGA plane areas of a PCB. Benefits include a controlled method for bridging multiple balls together by altering the solder mask.