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Metallization of Integral Heat Spreaders Through a Sputter or Evaporation Deposition Process

IP.com Disclosure Number: IPCOM000010571D
Publication Date: 2002-Dec-18

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that applies a thin layer of gold to the cavity of integral heat spreader, using a sputter or evaporation deposition process. Benefits include lower manufacturing costs and improved package thermal-mechanical performance.