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Disclosed is a method that uses a process vacuum to temporarily hold the die in place during wire bonding. Benefits include simplifying the assembly process and reducing material costs.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
Elimination of the Adhesion Medium
During the Die Attach Step in Wire-Bound Applications
Disclosed is a method that uses a process vacuum to
temporarily hold the die in place during wire bonding. Benefits include
simplifying the assembly process and
reducing material costs.
Currently an adhesive tape or paste is used to attach the die to the
substrate prior to wire bonding (see Figure 1). However, this solution is not
entirely reliable, and adds cost to the wire
In the disclosed
method, the die is held in place by a vacuum supplied through the substrate
ports (Figure 2). The wire bonding process proceeds while the die is held in
place via the vacuum.� The over mold is
done while the substrate/die interface is still under vacuum. This allows for
the� mold compound to be pulled under
the die to fill the substrate port(s); this creates a self-sealed environment
(Figure 3). The following is the proposed process flow:
The pick and place puts the die on the
The vacuum (via the ports in the
substrate) holds the die in place.
The die is wire bonded to the substrate.
The over mold is completed while the
substrate/die interface is under vacuum.
The following are advantages of the disclosed method:
costs by reducing materials
the assembly process
reliability by removing the die/adhesion/substrate interface