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Method for molding thin microprocessor MMAP packages for flip-chip dies

IP.com Disclosure Number: IPCOM000010574D
Publication Date: 2002-Dec-18
Document File: 2 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for molding thin microprocessor molded matrix array packages (MMAPs) for flip-chip dies. Benefits include improved reliability.