The following operators can be used to better focus your queries.
( ) , AND, OR, NOT, W/#
? single char wildcard, not at start
* multi char wildcard, not at start
(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*
This guide provides a more detailed description of the syntax that is supported along with examples.
This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.
Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.
Disclosed is a method for a solder preform as an interconnect for stacked multichip modules (MCMs). Benefits include improved functionality, improved throughput, and improved ease of manufacturing.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
59% of the total text.
Method for a solder preform as an interconnect for stacked
Disclosed is a method for a solder preform as an interconnect
for stacked multichip modules (MCMs). Benefits
include improved functionality, improved throughput, and improved ease of
� � � � � Conventionally, MCMs are stacked using a
paste print technology that is not cost efficient. MCMs are individually paste
printed and then stacked onto another package (see Figure 1). The conventional
solution uses an interposer (see Figure 2).
� � � � � Solder preform is conventionally used in
high-volume manufacturing packaging. Any shape can be manufactured through:
• � � � � Alloying the solder
• � � � � Stamping
• � � � � Extruding
• � � � � Compacting
• � � � � Forming into the shape size and form
� � � � � The disclosed method is a solder perform
interconnection for stacking MCMs (see Figure 3).
� � � � � Solder preform laid onto a metal pad during the reflow process
forms a solder interconnection through its high surface tension (see Figure 4).
Solder preform over nonmetal is wicked into existing metal pads.
� � � � � Package-to-package stacking on a wirebond
utilizes two substrate packages with a solder perform pad and molding compound
(see Figure 5).
� � � � � Package-to-package stacking on a flip chip
utilizes two substrate packages with a solder perform pad, solder bumps, and
solder bump pads (see Figure 6).