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Method for a solder preform as an interconnect for stacked MCMs

IP.com Disclosure Number: IPCOM000010577D
Publication Date: 2002-Dec-18

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a solder preform as an interconnect for stacked multichip modules (MCMs). Benefits include improved functionality, improved throughput, and improved ease of manufacturing.