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Concept Search - What can I type?
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Disclosed is a method for an improved coin-stack feeder to avoid part nesting of microelectronic package heatsinks. Benefits include improved reliability.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
70% of the total text.
Method for an improved coin-stack feeder to avoid part
nesting of microelectronic package heatsinks
Disclosed is a method for an improved coin-stack feeder to avoid
part nesting of microelectronic package heatsinks. Benefits
include improved reliability.
� � � � � Conventionally, higher power flip-chip
microelectronic packages require an integrated heatsink (IHS) to help dissipate
heat between the silicon and chip and mechanically protect the chip. In future,
packages are expected to require a stepped IHS design with a taper on the
surface of the lid. Due to the stepped IHS design, the possibility exists that
legacy shipping media may enable the tapered design to bind, causing jams when
the media is loaded into an automated tool. It uses the same shipping tube as
the feed to the machine for placing the lid onto the bare microelectronic
package (see Figure 1). A high probability exists that during shipping the
tapered lids will shift due to minimal contact area with the legacy media
design, causing exterior damage to the lids (see Figure 2).
� � � � � A coin-stack feeder the shape of a square
cross-section is used with the lids oriented in the same direction (see Figure
� � � � � The disclosed method
is an improved coin-stack feeder that avoids part nesting of microelectronic
package heatsinks. The method staggers the lids using a star shaped
cross-section for the coin-stack feeder, which does not allow the IHS lids to
bind (see Figure 4). Additiona...