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Mini Rings around core in semiconductor IC to reduce die-size

IP.com Disclosure Number: IPCOM000010717D
Original Publication Date: 2003-Jan-15
Included in the Prior Art Database: 2003-Jan-15

Publishing Venue

Motorola

Related People

Authors:
Chetan Verma Milind Padhye Sahil Dabare

Abstract

A technique to reduce the die size of a semiconductor IC is proposed. The proposed technique talks about “pre-inserting” two minimum width metal rings around the core in the ‘io-to-core’ region. The “pre-inserted” rings help eliminate the irregular and indisciplined routing in the io-to-core region. This frees up a lot of routing tracks in that region thereby resulting in the die-size reduction.