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Stacked Packages Using Anisotropic Conductive Films

IP.com Disclosure Number: IPCOM000010731D
Publication Date: 2003-Jan-15
Document File: 2 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses anisotropic conductive film (ACF) to bond and stack ultra thin flex tape packages. Benefits include minimizing interconnects and package height.