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Die/Substrate Interconnect Mechanism Using Tip-to-Plateau Metal Contact and Fusion

IP.com Disclosure Number: IPCOM000010740D
Publication Date: 2003-Jan-15
Document File: 2 page(s) / 39K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a new method for attaching dice on substrate, which uses the concept of tip-to-plateau metal contact and fusion. Benefits include increasing joint strength and reliability, and reducing the occurrence of non-wet issues.