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Method for patterned electroless deposition of metal and alloys

IP.com Disclosure Number: IPCOM000010781D
Original Publication Date: 2003-Jan-21
Included in the Prior Art Database: 2003-Jan-21

Publishing Venue

IBM

Abstract

Disclosed is a strategy to direct the metallization of a nonconductive substrate by combining microcontact printing (5CP) and electroless deposition (ELD). Such strategy provides an interesting alternative to conventional microfabrication procedures that otherwise would include the deposition of a metal in vacuum and patterning it using photolithography.