Browse Prior Art Database

Ultem® Resin for Flexible Printed Circuit Applications

IP.com Disclosure Number: IPCOM000010843D
Publication Date: 2003-Jan-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Thermoplastic resins can readily be formed into substrate films for flexible circuit applications. XH Ultem® resin from GE Plastics is a strong candidate for use in such films, where its physical characteristics can provide necessary performance for flex circuit assembly and function. Film dimensional stability over operating temperatures can be a distinguishing characteristic, one that can be changed by blending resin with fillers and by film processing. Keywords: XH Ultem, polyetherimide, thermoplastic film, flexible circuits, thermal expansion, fillers.