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Vertical interconnection between layers separated by thick isolation layers

IP.com Disclosure Number: IPCOM000010858D
Original Publication Date: 2003-Jan-28
Included in the Prior Art Database: 2003-Jan-28

Publishing Venue

IBM

Abstract

Disclosed is a new process sequence to create electrical interconnections through a thick separating layer. The interconnection consists of three parts. First, the electrical contact of the lower layer. Second, the separation material (e.g. Al2O3) which separates spatially the lower layer from the upper layer. Third, the interconnecting layer which is a thin film stripe of electrically conductive material. Here an idea is discussed where the interconnecting layer is thinner than the separating layer. For example, assuming a separating layer of 5 mu thickness, the interconnecting layer could be as thin as 0.1 mu. This is possible because the interconnecting layer is deposited onto a slope. The main part of the separation is overbridged by that slope.