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Method for a multi-fold BGA package

IP.com Disclosure Number: IPCOM000010885D
Publication Date: 2003-Jan-29
Document File: 2 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a multi-fold ball-grid array (BGA) package. Benefits include improved functionality, improved productivity, and improved ease of manufacturing.