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Low CTE Composite Substrate for Large Geometry Electronic Packages

IP.com Disclosure Number: IPCOM000010888D
Publication Date: 2003-Jan-29

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses multiple CTE cores/layers, in combination with organic package substrate build-up layers, to reduce shear stresses between the materials. Other benefits include compatibility with conductive and non-conductive low CTE materials.