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Method of Electromagnetic Interference Suppression for IHS Packaging

IP.com Disclosure Number: IPCOM000010966D
Publication Date: 2003-Feb-05
Document File: 2 page(s) / 39K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses the IHS heat slug as a common ground plane to suppress electromagnetic interference (EMI). The heat slug is connected to the Vcc planes in the substrate and uses a conductive solder paste. Benefits include an improvement in overall package performance.