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One-Piece Spring Clip for the Common Enabling Kit

IP.com Disclosure Number: IPCOM000011178D
Publication Date: 2003-Feb-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a one-piece spring clip to create pressure on the thermal interface material (TIM) between the CPU’s integrated heat spreader (IHS) and the heat sink base of Nocona form factor processors. Benefits include a reduction in material costs, and a design that can adapt to a variety of OEM/ODM business models.