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Substrate Mounting to Top-Side Silicon and Package Over Mold on Wire-Bond Packages to Facilitate Package Stacking

IP.com Disclosure Number: IPCOM000011425D
Publication Date: 2003-Feb-19

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that adheres a substrate to the top side of the silicon and over molds the package, in order to improve package stacking. Benefits include a lower total cost solution with increase package reliability.