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Stud Bump Pin Interconnect Via Flex Through Hole Flip Chip Package

IP.com Disclosure Number: IPCOM000011427D
Publication Date: 2003-Feb-19
Document File: 2 page(s) / 49K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a stud-bumped die with wire “tails” to form the interconnect pin. The flex substrates with plated through holes mirror the bump layout, rather than mirroring the substrate bump pads. Benefits include finer bump/pad pitch and reduced z-height.