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Disclosed is a method to reduce the Dk variation by matching the dielectric constants (Dks) of the laminate’s woven material with the fill material. Benefits include improved performance.
English (United States)
This text was extracted from a Microsoft Word document.
This is the abbreviated version, containing approximately
96% of the total text.
Method for matching the Dks of the laminate’s woven
material with the fill material to reduce the Dk variation
Disclosed is a method to reduce the Dk variation by matching the
dielectric constants (Dks) of the laminate’s woven material with the fill material.
Benefits include improved performance.
� � � � � Conventionally, when
the Dk of the laminate’s woven material is different from the Dk of the fill
material used to impregnate the woven material, signal’s integrity is degraded.
The problem occurs as the signal trace crosses over the glass bundles of the
woven material and the spaces between the glass bundles, which are filled with
resin. This problem is conventionally solved by specifying higher impedance
tolerances to accommodate the higher Dk variance, which reduces electrical
� � � � � The disclosed method
matches the Dk of the woven material (glass) with the Dk of the fill material
(resin) prior to producing the laminate. The signal integrity is improved.
� � � � � During the fabrication
of the printed circuit board laminates, the laminate manufacturer selects a
woven material with a Dk that matches or comes close to matching the Dk of the
fill material. The signal passing over the laminate experiences lower variation
in the Dk due to the matching.