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Simplified Universal Mechanical Test Board with Actual Board Attributes for Solder Joint Reliability Characterization

IP.com Disclosure Number: IPCOM000011433D
Publication Date: 2003-Feb-19

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a simplified, universal mechanical test board (MTB), which has a similar form factor, design, and layout as other BGA packages. Benefits include reduced costs for board designs, and during the environmental stress test.