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Disclosed is a method to attach capacitors to a substrate with solder joints under the capacitor. Benefits include increased capacitor density and reduced inductance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
Disclosed is a method to attach capacitors to a substrate
with solder joints under the capacitor.�
Benefits include increased capacitor density and reduced inductance.
The current state of the art requires that solder fillets
extend up the side of the capacitor where substrate lands extend beyond the
capacitor’s perimeter (see figure 1).�
Solder fillets limit the spacing between adjacent capacitors which
minimizes the number of capacitors that can be placed in a given area.� Therefore, increasing capacitance density is
restricted to increasing the capacitance value of a given capacitor.
The disclosed method adds additional capacitors in a given
area by (1) increasing the length of the capacitor termination and (2) placing
substrate lands under the capacitor rather than extending outside the perimeter
of the capacitor. Figure 2 illustrates the disclosed method.
The disclosed method decreases inductance by (1) reducing
the current path and (2) strengthening the inductance canceling affect of
adjacent capacitors.� Additionally,
capacitance density is increased by mounting capacitors closer together as
shown in figure 2.�