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Method for a heatsink with an integrated TEC and a tapered base

IP.com Disclosure Number: IPCOM000011515D
Publication Date: 2003-Feb-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink with an integrated thermoelectric cooler (TEC) and a tapered base. Benefits include improved thermal performance, improved functionality, and improved reliability.