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Method for improved adhesion between a metal layer and a BCB layer in wirebond RDL applications

IP.com Disclosure Number: IPCOM000011518D
Publication Date: 2003-Feb-26
Document File: 2 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for improved adhesion between a metal layer and a benzocyclobutene (BCB) layer in wirebond redistribution layer (RDL) applications. Benefits include improved functionality and improved performance.