Publishing Venue
The IP.com Prior Art Database
Abstract
Disclosed is a method for improved adhesion between a metal layer and a benzocyclobutene (BCB) layer in wirebond redistribution layer (RDL) applications. Benefits include improved functionality and improved performance.
Method for improved adhesion between a metal layer and a
BCB layer in wirebond RDL applications
Disclosed is a method for improved adhesion between a metal
layer and a benzocyclobutene (BCB) layer in wirebond redistribution layer (RDL)
applications. Benefits include improved functionality
and improved performance.
Background
� � � � � The concept of anchors is conventionally used in wafer
technology to promote the adhesion of various layers with different material
properties.
� � � � � The metal stacks used
in forming redistribution traces can adhere poorly to the underlying BCB layer
during RDL wirebond application (see Figure 1).
� � � � � Conventionally, no
solution exists to solve the poor adhesion between the metal and the BCB layer.
Description
� � � � � The disclosed method is improved adhesion between a
metal layer and a BCB layer in RDL applications. The contact surface of the metal and BCB layers is increased. Anchors are
created (using the via lithography process) selectively under the traces in the
BCB layer prior to the deposition of the metal stack (see Figure 2).
� � � � � The key element of the method includes the
use of the anchor concept to
create an increased surface area for traces that are created on top of the BCB
layer.
Advantages
� � � � � The disclosed method
provides advantages, including:
• � � � � Improved
functionality due to enabling RDL
applications for wirebond
• � � � � Improved functionality due to creating an increased surface area for...