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Low Cost Array Package and Method of Formation Disclosure Number: IPCOM000011602D
Original Publication Date: 2003-Mar-07
Included in the Prior Art Database: 2003-Mar-07

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Mark Gerber Steve Safai Dae Hong


Pricing pressures in IC assembly have forced companies, like Motorola, to investigate alternative array packaging solutions over current standard array packaging options such as the Plastic Ball Grid Array (PBGA). Limitations on leadframe based packages, such as total I/O count & package body size, have often steered new IC’s to be packaged in a BGA type packaging solution. The primary disadvantages of organic BGA packaging solutions, when compared to leadframe-based packages, include: higher I/O inductance, poorer thermal performance and usually higher cost. In an effort to provide an alternative array packaging solution that addresses each of these disadvantages, Motorola has developed a new array packaging solution that utilizes existing Mold Array Package (MAP) assembly equipment that enables a leadframe based array packaging solution. This publication will discuss the perceived benefits, concept overview, design options and the assembly flow methodology.