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A good copper remaining ratio for SLC chip carrier pattern plating

IP.com Disclosure Number: IPCOM000011705D
Original Publication Date: 2003-Mar-12
Included in the Prior Art Database: 2003-Mar-12

Publishing Venue

IBM

Abstract

This invention is about piece layout of PCB (Printed Circuit Boards) manufacturing panel for conductor thickness uniformity improvement. Circuit density uniformity and plating area of PCB manufacturing panel is important factor for circuitization with semi-additive plating. To uniform and to enlarge plating area improve plating thickness uniformity. Piece layout in this invention disclosure is described to uniform and enlarge plating area.