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Method for Configuring Bond Pad Order to Facilitate Simplified Substrate Routing

IP.com Disclosure Number: IPCOM000011729D
Publication Date: 2003-Mar-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that enables the order of pads to be configured on one or more devices during the assembly process. Benefits include a reduction in the overall cost of the package with a minimal cost increase to the silicon itself.