Browse Prior Art Database

Method for Mechanically Pinning an IC Package Heat Spreader to a Substrate

IP.com Disclosure Number: IPCOM000011730D
Publication Date: 2003-Mar-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for mechanically pinning an integrated circuit (IC) package heat spreader to a substrate. Benefits include improved performance, reliability, throughput, ease of manufacturing, and design flexibility.