Browse Prior Art Database

Method for thermally conductive fillers for semiconductor packaging materials with low electrical conductivity

IP.com Disclosure Number: IPCOM000011737D
Publication Date: 2003-Mar-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for thermally conductive fillers for semiconductor packaging materials with low electrical conductivity. Benefits include improved thermal performance, improved performance, and improved design flexibility.