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Method to attach a flip-chip die to a package without preapplying solder on the package bump pad using a eutectic column bump shape

IP.com Disclosure Number: IPCOM000011738D
Publication Date: 2003-Mar-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to attach a flip-chip die to a package without preapplying solder on the package bump pad using a eutectic column bump shape. Benefits include improved functionality, improved performance, improved design flexibility, improved ease of manufacturing, and improved yield.