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Method for cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects

IP.com Disclosure Number: IPCOM000011743D
Publication Date: 2003-Mar-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for cyclic three- and four-point bend test for the mechanical reliability of solder-joint interconnects. Benefits include an improved test environment and improved throughput.