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Structure and method for creating compliant, electromigration-resistant die-substrate interconnects

IP.com Disclosure Number: IPCOM000011843D
Publication Date: 2003-Mar-19

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a structure and method for creating compliant, electromigration-resistant die-substrate interconnects. Benefits include improved performance, improved reliability, and improved ease of manufacturing.