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Method for MCM package designs with flip-chips and wire-bond chips

IP.com Disclosure Number: IPCOM000011844D
Publication Date: 2003-Mar-19

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for multichip module (MCM) package designs with flip-chips and wire-bond (WB) chips. Benefits include improved functionality, improved thermal performance, and improved design flexibility.