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Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
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The present work discloses a technique to electrically connect a
Copper stiffener that is part of a cavity down electronic plastic ball grid
array package (PBGA) to its printed circuit laminate section.
English (United States)
This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
69% of the total text.
Page 1 of 2
A novelle technique to implement a Faraday cage structure in a cavity down
The present work discloses a technique to electrically connect a Copper stiffener that is part of a cavity down electronic plastic ball grid array package (PBGA) to its printed circuit laminate section.
As shown on Fig.1 the module configuration presents a Copper stiffener that, as a result of manufacturing process techniques and flows, ends in being attached with an insulating adhesive to the printed circuit board (PCB) laminate section leaving the Copper slug electrically floating.
In an expanding application space for this packages there is the need to have this large metal features no longer floating from the electrical stand point. It becomes important to have them connected to electrical circuits, generally to a Ground potential, which are present on the PCB section. This accomplish a higher EMI shielding from environmental electromagnetic noise and finally becoming a possible integration of a full Faraday's cage that completely surrounds the emitting or receiving device.
This discloses a technique to establish an electrical connection of the Cu slug to a receiving GND or circuits pads through a single or a series of holes in the stiffener as shown in Fig.2. By the insertion of a joining material, like a solder alloy or a polymer with conductive partic...