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A novelle technique to implement a Faraday cage structure in a cavity down PBGA package

IP.com Disclosure Number: IPCOM000011865D
Original Publication Date: 2003-Mar-20
Included in the Prior Art Database: 2003-Mar-20

Publishing Venue

IBM

Abstract

The present work discloses a technique to electrically connect a Copper stiffener that is part of a cavity down electronic plastic ball grid array package (PBGA) to its printed circuit laminate section.