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Disclosed is a method for coaxial solder ball shielding to reduce signal transmission loss between a component and a board. Benefits include improved performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
55% of the total text.
Method for coaxial solder ball shielding to reduce signal
transmission loss between a component and a board
Disclosed is a method for coaxial solder ball shielding to
reduce signal transmission loss between a component and a board. Benefits include improved performance.
� � � � � As telecommunication
and wireless devices go to higher frequencies and transmission speeds, the
design of interconnect structures between the component and the board must be
optimized (see Figure 1). The component/board solder ball/ pins, which
conventionally are short enough to be treated as a lump element, are
electrically long enough to be modeled as distributed transmission lines. The
conventional technology has a high input/output (I/O) impedance mismatch and
high inductance power delivery (PD), resulting in signal transmission loss and
higher droop. For example, at 40 GHz, a 1-mm ball pitch solder ball can have a
height of 410 µm, which is large (wavelength/10, assuming dielectric constant
of 4). The issue is greater for pin-type devices where the length is multiple
of the solder ball.
� � � � � The disclosed method
uses coaxial solder ball shielding to reduce signal loss between the component
and board. Honeycomb ground sheets are used to provide shielding between solder
balls. This method reduces the impedance of input/output and power delivery
inductance between component/board.