Browse Prior Art Database

Method for a die-down FCBGA/FCPGA package with an embedded metal heat spreader as the package core

IP.com Disclosure Number: IPCOM000011942D
Publication Date: 2003-Mar-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a die-down flip-chip ball grid array/flip-chip pin grid array (FCBGA/FCPGA) package with an embedded metal heat spreader as the package core. Benefits include improved thermal performance.